Types of thin film contact systems


PRODUCT SPECIFICATION


SPECIFIED AREA
up to 3 mm to edge


GENERAL CHARACTERISTICS

Au CONTACT SYSTEM Ni+Au NiCr+Ni+Au Ti+Pd+Au TiW+Pd+Au TiW+Au
Ag CONTACT SYSTEM Ni+Ag NiCr+Ni+Ag Ti+Pd+Ag TiW+Pd+Ag TiW+Ag
Cu CONTACT SYSTEM Ni+Cu NiCr+Ni+Cu Ti+Pd+Cu TiW+Pd+Cu TiW+Cu
PROCESSING TEMPERATURE ( C ) 250-400 250-400 300-400 300-400 350-400
ADHESION (N/mm2) SOLDERING 20 20 20 20 not recommended
ADHESION (N/mm2) BONDING exceeds tensile strength of Au wire

Notice: Processing temperatures are valid for Au top layers only.


STANDARD THICKNESSES OF SPUTTERED THIN FILMS

 

TOLERANCE (%)
COMPONENT THICKNESS
(nm)
COMPLETE
DELIVERY
WITHIN
SUBSTRATE
Ni 100 - 200 ± 15 ± 5
NiCr 100 - 200 ± 10 ± 5
Ti 50 - 100 ± 10 ± 5
TiW 25 - 100 ± 10 ± 5
Pd 100 - 300 ± 10 ± 5
Au 100 - 5.000 ± 15 ± 5
Ag 100 - 10.000 ± 15 ± 5
Cu 100 - 5.000 ± 15 ± 5


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