Thin film resistive layer   NiCr 15 or  NiCr 25


PRODUCT SPECIFICATION


SUBSTRATE
Glass, Sital, Polished Ceramic, Ceramic as Fired, others on request

CONTACT
Ti + Pd + Au, Ni + Au, TiW +Pd + Au, TiW + Au, others on request

SPECIFIED AREA
up to 3 mm to edge

RESISTOR VALUES
12 - 200  Ω / sq. , others on request
 

UNIFORMITY OF FINAL SHEET RESISTIVITY
Annealing 2 h/350 C:
complete delivery:   ± 15%  on ceramic
complete delivery:   ± 10%  on glass
within batch:           ± 6%   on ceramic
within batch:           ± 3%   on glass

STABILITY, MAXIMUM RESISTIVE CHANGE
after 1.000 h at 125 °C:     < 0.15% on ceramic and glass
after 1.000 h at 150 °C:     < 0.25% on ceramic and glass
after 10.000 h at 125 °C:   < 0.22% on ceramic and glass
after 10.000 h at 150 °C:   < 0.30% on ceramic and glass

TEMPERATURE COEFFICIENT OF RESISTANCE TCR
within -55 °C to +150 °C:
absolute - ppm/°C:         0 ± 15  NiCr 15
absolute - ppm/°C:         0 ± 25  NiCr 25
tracking - ppm/(°C.cm):    < 5    NiCr 15, NiCr 25
 


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