Thin film resistive layer NiCr 5


PRODUCT SPECIFICATION


SUBSTRATE
Glass, Sital, Polished Ceramic, as Fired Ceramic, others on request

CONTACT
Ti + Pd + Au, Ni + Au, TiW +Pd + Au, TiW + Au

SPECIFIED AREA
up to 3 mm to edge

RESISTOR VALUES
3 - 120 Ω / sq., others on request

UNIFORMITY OF FINAL SHEET RESISTIVITY
annealing temperature (2 h) of NiCr 5 layers depends on the sheet resistivity and/or substrate structure and varies from 280 °C to 330 °C

complete delivery:   ± 15% on ceramic
complete delivery:   ± 10% on glass
within batch:             ± 6%   on ceramic
within batch:             ± 3%   on glass

STABILITY, MAXIMUM RESISTIVE CHANGE
after 1.000 h at 125 °C:     < 0.10% on ceramic and glass
after 1.000 h at 150 °C:     < 0.25% on ceramic and glass
after 10.000 h at 125 °C:   < 0.15% on ceramic and glass
after 10.000 h at 150 °C:   < 0.30% on ceramic and glass

TEMPERATURE COEFFICIENT OF RESISTANCE  (TCR)

 within -55 °C to +150 °C:
absolute - ppm/°C:         0 ± 10
tracking - ppm/(°C.cm):    < 1
 

 within 0 °C to +60 °C:
absolute - ppm/°C:         0 ± 5
tracking - ppm/(°C.cm):    < 1


Back to "Resistive layers" page