Equipment & Technology

THIN FILM PRODUCTION

We are equipped with three devices for magnetron sputtering and a device for ion etching installed in a modern dust-free room. This is accompanied with a facility for photolithographic patterning of thin films and a testing laboratory for the control of the quality of deposited layers.

 

MAGNETRON SPUTTERING

  • DC and RF sputtering for the deposition of both conductive and non-conductive materials (see Materials and substrates)
  • the possibility of RF sputter cleaning of substrates
  • the sputtered area up to 300 x 300 mm in a semi-continuous device (possibility of high-volume manufacturing)
  • up to 3 different sputtered under one vacuum cycle
  • the possibility of coaxial sputtering, sputtering of complex shapes and through-hole sputtering

ION ETCHING

  • etching or milling by energetic Ar ions
  • for dry patterning of thin films or surface treatment
  • ion beam diameter 75 mm
  • ion deposition of both conductive and non-conductive materials

TESTING LABORATORY

  • profilometric measurement of thickness
  • measurement of electric parameters of thin films
  • optical microscopy
  • possiblity of SEM and AFM images of films and surfaces

PHOTOLIHTOGRAPHIC PATTERING OF THIN FILMS

  • wet patterning of thin films by photolithography
  • dimensions of substrates 50 – 100 mm