MATERIALS
We are able to sputter a wide range of both metallic and non-metallic materials. We have an extensive offer of sputtering materials with targets directly at our disposal. The offer of sputtered materials is divided into the following 3 categories:
STANDARD MATERIALS – materials that are regularly used in our production (short lead times, good prices).
CUSTOM MATERIALS – materials that are not regularly used in our production. The maximal sputtered area in one batch is 300 x 300 mm and there is a possibility to sputter up to 3 materials in one vacuum cycle.
SPECIAL MATERIALS – the maximal sputtered area is less than 300 x 300 mm and may vary from material to material.
In addtition to these materials listed in teble below, we offer also a deposition of oxides and nitrides by reactive sputtering.
| Standard materials | Custom materials | Special materials |
|---|---|---|
|
TiW (10:90) |
Ti |
ZnO |
|
NiCr (50:50) |
Ti-Si |
HfO2 |
|
Ni (7% V) |
Ta |
Ta2O5 |
|
Pd |
Cr |
PTFE |
|
Au |
CrSi2 |
Si3N4 |
|
Al |
Mo |
SiO2 |
|
Al (1% Si) |
W |
SiO |
|
Al (4% Cu, 1% Si) |
Cu |
SiO-Cr |
|
|
Ag |
BaTiO3 |
|
|
ITO |
Ru |
|
|
C |
Ir |
|
|
Si |
|
|
|
Sn |
|
Materials not listed in the table may be available on request.
SUBSTRATES
Our common practice is the processing of substrates supplied by the customer, but we can procure substrates on request. We have experience with substrates ranging from common substrates for hybrid and integrated circuits (ceramics, silicon, glass), the wide range of metallic materials to polymeric and composite materials.
In addition to processing the flat substrates, we have the possibility to coat more complex geometries (e.g. rotationally symmetrical items, hollows etc.). If you have such demands, please contact us.
