EQUIPMENT & TECHOLOGY

THIN FILM PRODUCTION

We are equipped with three devices for magnetron sputtering and a device for ion etching installed in a modern dust-free room. This is accompanied with a facility for photolithographic patterning of thin films and a testing laboratory for the control of the quality of deposited layers.

MAGNETRON SPUTTERING

  • DC and RF sputtering for the deposition of both conductive and non-conductive materials (see Materials & substrates)
  • the possibility of RF sputter cleaning of substrates
  • the sputtered area up to 300 x 300 mm in a semi-continuous device (possibility of high-volume manufacturing)
  • up to 3 different sputtered under one vacuum cycle
  • the possibility of coaxial sputtering, sputtering of complex shapes and through-hole sputtering

ION ETCHING

  • etching or milling by energetic Ar ions
  • for dry patterning of thin films or surface treatment
  • ion beam diameter 75 mm
  • ion deposition of both conductive and non-conductive materials

PATTERING OF THIN FILMS

  • dry (ion) etching 
  • photolithography
  • chemical laboratory for wet etching and analysis
  • deposition through metal masks

METROLOGY

  • profilomethic measurement of film thickness
  • measurement of electric properties od thin films 
  • optical microscopy
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